本帖最后由 宅男女神 于 2016-2-14 18:04 编辑 IRF 网络虚拟化技能能够完成数据中心的横向结合。引进IRF 虚拟化规划方法以后，在不改动传统规划的& ?: b2 J1 S/ l/ ~
网络物理拓扑、确保现有布线方法的前提下，以IRF 的技能完成网络各层的横向结合，行将交流网络每一层的6 u7 J+ F4 E& [: B- ]' h3 S' r6 ~; `
两台、多台物理设备运用IRF 技能构成一个一致的交流架构，减少了逻辑的设备数量2 n: V7 ]8 v, r3 j
图1 IRF技能完成数据中心网络结合$ y; r+ [$ T0 G8 m4 }5 `
数据中心网络接入层通过布置 IRF 技能，能够躲避传统网络规划时MSTP+VRRP 带来的办理复杂性。别的，( L4 \- h- w! a3 |. ^1 B
选用IRF 技能能够完成跨设备链路聚合，不只提高了网络接入层的可用性，一起也提高了接入层上行带宽。
0 t8 l2 C3 v7 X* Q- F2 P数据中心会聚层交流机是接入层流量的汇集点和服务器网关。在根据IRF 技能架构的会聚层设备上可布置8 m: L6 D% p! {
FW 板卡和LB 板卡以完成对服务器区的拜访操控和事务优化才能。从逻辑上看，根据交流机IRF 架构布置安全
6 T o3 S$ i# Y$ W0 V+ e2 {板卡，与在一台交流机上插多块板卡的组网方法是一样的，因此这种布置方法带来的优点是：网络拓扑简略、# T7 D. B7 S1 L( X) c" V
板卡装备灵敏、层次明晰。) m+ B5 j& U: R) |
数据中心核心层布置IRF 技能能够简化会聚层与核心层之间的网络拓扑和路由规划。* u- J2 w% G( E$ N; w; x
本文描绘了数据中心端到端IRF 计划中各层网络设备的装备方法，其间要点介绍了HP A7500 IRF 架构上1 |2 g) n) M. O) R7 N g/ R/ ~3 V
FW、LB 板卡的装备。主要内容包含：( T$ F' [; \% f$ o
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概述 ···········································29 K' [9 b( h$ b0 _9 @
数据中心端到端IRF架构典型组网······························3
! p+ |. l6 s! z/ Q: Y典型组网 ·························································································································3
* X- Q+ ~! e2 O# t4 V会聚层FW/LB规划方案········································································································6; a+ C- g% z# k- Z7 ^
FW+LB规划··················································································································6" ~+ K6 e" R$ Q: M9 Z7 e
LB+FW规划··················································································································8
5 o8 p! H4 z6 R会聚层流量规划··············································································································· 10+ B- D+ V! i6 {- _+ F
FW+LB规划················································································································ 10
, t+ a1 R' C0 q2 B' s* kLB+FW规划················································································································ 11
( q; [' f# ^, ]2 Y! ~交换机IRF装备布置··································· 11) U# \' y+ y4 l7 o- C* I4 i
会聚层HP A7500 布置典型组网一······················································································· 12
0 z# Y8 B8 Z+ `. b2 ]布置阐明 ··················································································································· 12
6 a0 p* v; Q+ a. n- [) ^会聚层HP A7500 布置典型组网二······················································································· 18
9 X& D3 n* t" t$ Z布置阐明 ··················································································································· 18+ h3 |1 C2 @& h- t9 ^0 o6 }! O+ z
核心层HP A12500 布置举例······························································································· 198 W) J- l/ N" b5 J, U4 `6 X
接口路由装备············································································································· 19. ^. |2 _, k I ~+ C. W9 l
IRF装备····················································································································· 20% R8 d1 X& [* ^+ S) A
接入层HP A5800 布置举例································································································ 213 O2 \' {- @3 P) M& x
接口装备 ··················································································································· 21& h p( t9 }6 I- `
IRF装备····················································································································· 21
* G0 t% E+ b% M) XSecBlade FW板卡规划布置································ 22
' D" K9 ]4 A. l( e2 J. VSecBlade FW布置典型组网一···························································································· 22
8 ^6 t0 Y9 K* g$ h布置阐明 ··················································································································· 22
6 T9 d" z, P7 Q5 ]$ r/ B4 y" C* ZSecBlade FW布置典型组网二···························································································· 27( {- v. G! n7 Q) Y8 J
布置阐明 ··················································································································· 27
5 k: ~! a& g- O- r3 wSecBlade LB规划布置·································· 282 \+ t4 g6 |4 ?% H
SecBlade LB布置典型组网一····························································································· 28: E K g& R6 o
布置阐明 ··················································································································· 28
9 v" n" L0 B8 F9 G; j- [SecBlade LB布置典型组网二····························································································· 31
; I6 k+ P# M" ]布置阐明 ··················································································································· 31
- G9 o- O+ P) p4 K- W1 ?( s0 ^整网双机HA规划布置··································· 325 C/ |" H* z% j* e
链路毛病切换·················································································································· 32
y1 d5 x4 W/ w8 IIRF堆叠交换机之间相连链路毛病切换·············································································· 32) @4 Z: r3 m9 Z. f2 |9 G
HP A7500 交换机间堆叠链路断链毛病切换······································································· 32
8 \1 J- v* i) p5 }( b( z* X板卡毛病切换·················································································································· 32
4 b; T# w" y$ |. Y7 @. L2 I3 jFW板卡毛病切换········································································································· 32& _. X' J* r/ h! l# }' _! U
LB板卡毛病切换·········································································································· 32
8 t7 R- u( z* t4 q整机毛病切换·················································································································· 33
" e2 x# A" x' d解决方案重要局限性··································· 337 U6 z" B6 H6 z1 m) P' x
Troubleshooting ···································· 33
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